1 edition 1.1 july 2004 driver integrated 10gb/s mi-dfb ld module FTM1141GF-C parameter condition symbol operating case temperature t op(tc) c modulator (mod) modulation control voltage vm v mod bias control voltage v b v power supply voltage v ss v laser forward current if ma cw laser reverse voltage vr v cw storage temperature t stg c differential (ac-coupled) data input voltage din, dinb vpp note (1-1) esd tolerance vesd v note (1-2) esd tolerance vesd v photodiode forward current - - ma photodiode reverse voltage vdr v 260 c max lead soldering time sec cooling heating tec voltage vc v cooling heating a tec current ic tth thermistor temperature c cw optical output power pf mw unit absolute maximum ratings (top=25 c, unless otherwise specified) limits 0 -6.5 -6.5 -6.5 - - -40 - - - - - - atc operation - -1.0 - -0.5 0 - min. v ss -4.8 (min-6.5) cross point control voltage vx1,(vx2) v 75 v ss +1.2 (max0) v ss +2.4 (max0) 0 150 2 85 1.6 50 200 1 10 10 2.5 - 1.5 - +75 5 max. v ss +2.4 (max0) features ? driver integrated 10gb/s mi-dfb module for 1600ps/nm optical transmission ? mi-dfb-ld (modulator integrated dfb laser diode) is installed ? modulator driver ic is installed ? built-in optical isolator, pin-photo diode for monitor, thermistor and thermo-electric cooler ? 1600ps/nm (80km) description the FTM1141GF-C was developed to reduce the size and technical complexity of 10gb/s optical board designs. this product, which includes a driver and modulator integrated laser in one package, eliminates the customer concerns regarding how to handle the rf interfacing between these two components on his board. by co-packaging these components a solution has also been achieved that offers greatly reduced board space. this reduction in space is critical for next generation transponder applications. the FTM1141GF-C has been designed with a differential co-planar electrical interface which allows for easy interfacing to rf lines on pc boards. the package and pinout are part of a multi-source agreement. this product is designed for 80km sonet/sdh applications and single channel drop links in dwdm systems.
parameter limit laser diode and modulator charactersitics optical specifications (t ld =25 c, t op =0 to 75 c and bol, unless otherwise specified) unit symbol condition min. max. typ. optical output power dbm pop +1.0 +3.5 - note (2a) forward voltage v vf - 2.2 1.4 cw, i f =i op extinction ratio db rext 9.0 - - pf=pop, note (2a) peak wavelength nm wp 1530 1565 - pf=pop, note (2a) side mode suppresion ratio db ssr 35 - - i f =pop, cw optical rise time psec tr -30 - note (3), 20% to 80% optical fall time psec tf -30 - note (3), 20% to 80% optical isolation db is 25 - - tracking error db te -0.5 +0.5 - note (2a) input return loss db s11 6- - 130khz to 10ghz dispersion penalty db dp - 2.0 - note (2) eye pattern mask msk error free note (2a), 500 counts cw threshold current ith ma - - 25 - ma pf=pop operating current iop 40 100 70 parameter limit monitor diode characteristics unit symbol condition min. max. typ. monitor diode capacitance pf ct -15 5 vdr=5v, f=1mhz i f =i op , vdr=5v monitor current im a 100 1500 - na vdr=5v monitor dark current id - 100 2 parameter limit tec & thermistor characteristics unit symbol condition min. max. typ. tec power consumption w k pc - 2.0 - note (4) thermistor resistance k ? rth -- 10 tld=25 c 25/75 c thermistor b constant b 3270 3630 3450 note (4) tec current ic a - 1.0 - v note (4) tec voltage vc - 2.0 - 2 driver integrated 10gb/s mi-dfb ld module FTM1141GF-C
3 driver integrated 10gb/s mi-dfb ld module FTM1141GF-C parameter limit driver ic characteristics unit symbol condition v vpp min. max. typ. modulator (mod) modulation control voltage v vm v ss v ss +1.0 - mod bias control voltage v vb v ss v ss +2.2 - differential (ac coupled) data input voltage din, dinb 0.5 1.0 - xp=50% cross point (xp) control voltage vx1, (vx2) v ss +0.8 v ss +2.2 - driver ic supply voltage vss v -5.5 -4.9 -5.2 ma driver ic supply current iss - 285 - note (1-1): pin no. 3,4,5,6,7,9,11 (human body model) note (1-2): pin no. 1,2,8,10,12-19 (human body model) note (2): eudyna test system (a) drive condition bit rate: 9.95328 gb/s word pattern: prbs=2 31 -1 mark density: 50% laser bias current: i op laser temperature(tld): 25 c eye pattern mask: itu-t eye mask for stm-64 (b) fiber dispersion 1600ps/nm (c) dispersion penalty bit error rate=10 -12 note (3): eudyna test system vb, vm, vx1(vx2) is set to make pop and rext within the specification note (4): eudyna test system operating case temperature: t op =+75 c laser temperature: 25 c optical output power: pf=pop, note (2a) typical output waveform back to back (with filter) 9.95328gb/s, nrz, prbs=2 31 -1, tld=tc=25 c
4 driver integrated 10gb/s mi-dfb ld module FTM1141GF-C pd pd ld nc nc tec gnd gnd blocking capacitor ex. 0.1f din gnd dinb gnd vx1 vx2 cross point control bias voltage control supply voltage modulation voltage control vss vm vb ther r tec chip capacitor 0.1f chip capacitor 0.1f typical application for driver ic for stable operation: 8-1. to prevent a dependence of cross point on the supply voltage vss, (1) use an external voltage source of -3.8v for vx2 , or (2) control the voltage of vx1 , so that the voltage difference vx1-vx2 remain constant. 8-2. to prevent a dependence of modulation control voltage on the supply voltage vss, control the voltage of vm , so that the difference vm-vss remain constant. 8-3. to prevent a dependence of bias control voltage on the supply voltage vss, control the voltage of vb , so that the difference vb-vss remain constant.
5 14-0.3 6.00 0.25 5-0.15 0.08 4.95 22.0 18.0 12.0 35 1 ?0.9 0.1 ?5.20 0.25 4-?2.6 0.2 note: pigtail length (l) shall be specified in the detail (individual) specification. connector detail-b l 5.3 17.6 detail a detail b 13.6 9.6 19 13 1 7 8 12 25.0 0.5 1.25 (3) 0.5 7.7 14-0.2 4.86 0.20 1.25 4.56 4.46 0.20 3.56 5-0.3 4-p1.0 4.00 0.25 pin description 1. thermoelectric cooler(anode, +) 2. thermistor 3. vb: modulator bias control voltage 4. vm: modulator modulation voltage control voltage 5. vss: driver ic supply voltage 6. vx2: cross point control voltage 7. vx1: cross point control voltage 8. case ground 9. dinb: inverted data input voltage 10. case ground 11. din: data input voltage 12. case ground 13. monitor photo diode(cathode) 14. monitor photo diode(anode) 15. case ground 16. ld bias(anode) 17. nc 18. nc 19. thermoelectric cooler(cathode, -) 12-p1.0 5.8 detail-a ? gf ? package unit: mm driver integrated 10gb/s mi-dfb ld module FTM1141GF-C eudyna devices inc. products contain gallium arsenide (gaas) which can be hazardous to the human body and the environment. for safety, observe the following procedures: caution do not put this product into the mouth. do not alter the form of this product into a gas, powder, or liquid through burning, crushing, or chemical processing as these by-products are dangerous to the human body if inhaled, ingested, or swallowed. observe government laws and company regulations when discarding this product. this product must be discarded in accordance with methods specified by applicable hazardous waste procedures. for further information please contact: eudyna devices usa inc. 2355 zanker rd. san jose, ca 95131-1138, u.s.a. tel: (408) 232-9500 fax: (408) 428-9111 www.us.eudyna.com eudyna devices europe ltd. network house norreys drive maidenhead, berkshire sl6 4fj united kingdom tel: +44 (0) 1628 504800 fax: +44 (0) 1628 504888 eudyna devices asia pte ltd. hong kong branch rm. 1101, ocean centre, 5 canton rd. tsim sha tsui, kowloon, hong kong tel: +852-2377-0227 fax: +852-2377-3921 eudyna devices inc. sales division 1, kanai-cho, sakae-ku yokohama, 244-0845, japan tel: +81-45-853-8156 fax: +81-45-853-8170 eudyna devices inc. reserves the right to change products and specifications without notice. the information does not convey any license under rights of eudyna devices inc. or others. ? 2004 eudyna devices usa inc. printed in u.s.a.
|
